SOI Process
About SOI Process
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Two types of process
- Process 1
- Form buried oxide on handle layer and polish bonded device layer.
- Process 2
- Form buried oxide on device layer and polish bonded device layer.
- ELECTRONICS AND MATERIALS CORPORATION LIMITED
LED products, solar products, silicon wafers, compound wafer, SOI wafer,
the import of various semiconductor materials, and Cells.
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Exclude weekends and holidays
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